Logistics Master Data Design. Manufacturing. SAP Best Practices

1. Logistics Master Data Design Manufacturing

SAP Best Practices Baseline Package

2. Product Hierarchy

This data
is created in
BB 104
Logistics
Level 1
00001
Top Level
Level 2
00001B0001
Products A
(Manufact./Trade)
00001B0002
Products B
(Services)
Level 3
00001B000100000001
Products A.01 (MTO)
00001B000100000002
Products A.02 (MTS)
00001B000100000003
Parts A.03
00001B000200000001
Products B.01
00001B000200000002
Products B.02
All material master records assigned
to product hierarchy level 3
CO-PA
SOP Interface
© 2013 SAP AG. All rights reserved.
Product Hierarchy
Level 3
Product Group
Level 2
2

3. Product Group Manufacturing / Trading

Product Group
This data
is created in
BB 143
Manufacturing / Trading
Level 1
Plant
1000
00001B001
Products A
Level 2
00001B000100000001
Products A.01
(MTO)
Material*:
F226
F100-M1
F1000-P1
00001B000100000002
Products A.02
(MTS)
Material*:
F126
F29
00001B000100000003
Parts A.03
Plant
1000
Material*:
H11
S23
S25
* Not all materials used are
assigned to sample
product groups
CO-PA
SOP Interface
© 2013 SAP AG. All rights reserved.
Product Hierarchy
Level 3
Product Group
Level 2
3

4. Classification Class & Characteristics for Batches

Classification
This data
is created in
BB 117
Class & Characteristics for Batches
Class - 023
YB_EXP_DATE_001 Batch
Products with Expiration
Date
Char.
LOBM_VFDAT
Expiration date, shelf life
Class - 023
YB_EXP_DATE_002 Batch
Search class with
expiration date
Char.
LOBM_RLZ
Remaining Shelf Life for Batch
© 2013 SAP AG. All rights reserved.
Char.
LOBM_VFDAT
Expiration date, shelf life
Used in all
processes
which are
using batch
materials
Class - 023
YB_BATCH
Batch FIFO 1
Char.
YB_BATCH_NUMBER
Batch Number
Char.
LOBM_LFDAT
Batch Determin. Delivery Date
Char.
YB_SUPPLIER_BATCH_NUMBER
Vendor Batch Number
4

5. Classification Class & Characteristics for PO Release

Classification
Class & Characteristics for PO Release
Procurement
Processes
using PO
release
strategy
Class 032
R2R_CL_REL_CEKKO
PO Release at Header Level
Char
R2R_PURCH_ORD_TYPE
Order type(Purchasing)
Values
FO Framework
NB Standard PO
UB Stock transport order
© 2013 SAP AG. All rights reserved.
Char
R2R_PURCH_ORD_VALUE
Total net order value
Values
Amount and Local
Currency
This data
is created in
BB 104
Char
R2R_PURCH_GRP
Purchasing group
Values
Purchase Group
5

6. Trading Goods Product Structure

Trading Goods
This master data
is created in
BB 152
Product Structure
H12
H11
Trading Good,
Reorder Point, Reg. Trading
(HAWA-VB)
Trading Good,
Reg.Trading
(HAWA-PD)
H12
H11
Trading Good,
Reorder Point, Third Party
(HAWA-VB)
Trading Good,
Third Party
(HAWA-PD)
H20
Used in all
MM/SD
Scenarios
for Man
(reused
from
Trade).*
Used in
Third Party
w. / w/o
Shipping
Notification
SN
Master
Data
Enhance
ment in
BB (126 –
Layer 2
Trading Good,
Reorder Point, Serial No
(HAWA-VB)
H20
B
Trading Good, Reorder Point,
Batch-FIFO
(HAWA-VB)
H21
Trading Good,
Reorder Point, Batch Exp.Date
(HAWA-VB)
SN Serial Numbers
B Batch Management
* Except Scenarios:
Third Party Order
Proc. and Sales
Bought In item
© 2013 SAP AG. All rights reserved.
B
H14
Trading Good, Bought-In
(HAWA-PD)
Master
Data
Enhance
ment in
BB (117 –
Layer 2
Used in all
MM /SD
Scenarios
for Man.
(reused
from Trade)
showing
(Serial Nos)
Used in all
MM /SD
Scenarios
for Man.
(reused
from
Trade)
(Batch Man.
Funct.)
Used in
Sales
Bought in
Item
6

7. Returnables Product Structure

Returnables
This master data
is created in
BB 152
Product Structure
L001
Empties
Returnables
Processing
(LEIH-ND)
© 2013 SAP AG. All rights reserved.
7

8. MTO with Variant Configuration Product Structure

MTO with Variant Configuration
This data
is created in
BB 143 & 147
Product Structure
F1000-M1 – Metal with Normal Shrink Wrap
F1000-P1 – Plastic with Normal Shrink Wrap
F1000-G1 – Golden with Normal Shrink Wrap
F1000-G2 –Golden with Special Packaging
K-Item Category
Class-Component 1
Class-Component 2
S25
Semifinished Good,
Repetitive Manuf.
(HALB-20-PD)
F100
Finished Good MTO VC
Configurable
(KMAT-PD)
R20
Raw Material
(ROH-PD)
Class: YB_CL_TYPE_COMP_1 (S2201, S2202, S2203)
CF
R28
R27
Raw Material,
Packaging Foil
(ROH-PD)
Raw Material,
Packaging Box
(ROH-PD)
VC Dependencies:
YB_PACKAGING_1
= NORMAL
VC Dependencies:
YB_PACKAGING_2
= SPECIAL
Class: YB_CL_TYPE_COMP_2 (S2301, S2302, S2303)
S2201
S2301
Semifinihed Good
Phantom Ass.,Plastic
(HALB-50-PD)
Semifinihed Good
Phantom Ass.,Plastic
(HALB-50-PD)
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
Master
Data
Enhance
ment in
BB 149
Layer 2
Repetitive
Manufacturing
SC
R1601
R1701
R1801
R1301
R1401
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
S2202
S2302
Semifinihed Good
Phantom Ass.,Metal
(HALB-50-PD)
Semifinihed Good
Phantom Ass.,Metal
(HALB-50-PD)
SC
R1602
R1702
R1802
R1302
R1402
RAW Mat., Metal
(ROH-PD)
RAW Mat., Metal
(ROH-PD)
RAW Mat., Metal
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
S2203
S2303
Semifinihed Good
Phantom Ass.,Goldenl
(HALB-50-PD)
Semifinihed Good
Phantom Ass.,Golden
(HALB-50-PD)
Master
Data
Enhance
ment in
BB 138
Layer 2
MM Subcontracting
SC
R1603
R1703
R1803
R1303
R1403
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
© 2013 SAP AG. All rights reserved.
MTO with
Variant
Configur
ation
CF Configurable
SC Subcontracting
8

9. MTO Production – Variant Configuration BOM Allocation

MTO Production – Variant Configuration
This data
is created in
BB 147
BOM Allocation
Variant Links to maximum material BOM
F1000
Finished Good MTO VC
Configurable
(KMAT-PD)
CF
K-Item Category
Class-Component 1
Class-Component 2
F1000-M1
F1000-P1
F1000-G1
F1000-G2
Finished Good
Material variant, Metal,Foiled
(FERT-PD)
Finished Good
Material variant, Plastic,Foiled
(FERT-PD)
Finished Good
Material variant, Golden,Foiled
(FERT-PD)
Finished Good
Material variant, Golden,Boxed
(FERT-PD)
Type of Material
Metallic - Component 1
Type of Material
Plastic - Component 1
Type of Material
Golden - Component 1
Type of Material
Golden - Component 1
Type of Material
Metallic - Component 2
Type of Material
Plastic - Component 2
Type of Material
Golden - Component 2
Type of Material
Golden - Component 2
S25
Semifinished Good,
External Procurement
(HALB-20-PD)
R20
Raw Material
(ROH-PD)
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
R28
Raw Material,
Packaging Foil
(ROH-PD)
R27
Raw Material,
Packaging Box
(ROH-PD)
© 2013 SAP AG. All rights reserved.
S25
S25
S25
S25
Semifinished Good,
External Procurement
(HALB-20-PD)
Semifinished Good,
External Procurement
(HALB-20-PD)
Semifinished Good,
External Procurement
(HALB-20-PD)
Semifinished Good,
External Procurement
(HALB-20-PD)
R20
R20
R20
R20
Raw Material
(ROH-PD)
Raw Material
(ROH-PD)
Raw Material
(ROH-PD)
Raw Material
(ROH-PD)
S21
S21
S21
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
Shrink-Wrap Packaging
Shrink-Wrap Packaging
Shrink-Wrap Packaging
Packaging Box
CF Configurable
9

10. Classification Class & Characteristics for Variant Configuration

Classification
This data
is created in
BB 147
Class & Characteristics for Variant Configuration
Class -200
YB_CL_TYPE_COMP_1
Class . Component 1
Class -200
YB_CL_TYPE_COMP_2
Class . Component 1
Char.
YB_BASIC-MATERIAL_1
Type of Material
Char.
YB_BASIC-MATERIAL_1
Type of Material
Values
PLASTIC
METAL
GOLDEN
Description
Plastic
Metallic
Golden
© 2013 SAP AG. All rights reserved.
Values
PLASTIC
METAL
GOLDEN
Description
Plastic
Metallic
Golden
Class -200
YB_CL_TYPE_PROD_1
Class . Finished Good 1
Char.
YB_BASIC-MATERIAL_1
Type of Material
Values
PLASTIC
METAL
GOLDEN
Description
Plastic Pen
Metallic Pen
Golden Pen
MTO
Production
with Variant
Configuration
Char.
YB_PACKAGING_1
Type of Packaging
Values
NORMAL
SPECIAL
Descriptions
Shrink-wrap Packaging
Special Packaging
10

11. MTS Production - Process Industry Product Structure

MTS Production - Process Industry
This master data
is created in
BB 143
Product Structure
PI-Sheet not included in process
Exp. date
B
MTS
Production
– Process
Industry
F29
Master
Recipe
F29
Finished Good MTS PI
(FERT-PD)
All SD
processes
For Manufacturing*
10 - Final Operation
R15
FIFO
B
S24
Semifinished Good
Batch-FIFO, Liquid
(HALB-PD)
RAW Material
(ROH - PD)
Master
Recipe
S24
10 - Operation 1
20 - Operation 2
R09
B
FIFO
RAW Material
Batch FIFO
(ROH - PD)
R19
B
FIFO
All other Raw
Materials
used in MM /
Procurement
Processes
RAW Material
Batch FIFO, Lean QM
(ROH - PD) LQ
R30
LQ Lean QM
B Batch Management
* Except Scenarios: Third Party Order Proc. Sales Bought In item, Returnables
Processing
© 2013 SAP AG. All rights reserved.
B
Bulk
Material
FIFO
RAW Material, Batch
FIFO, Reorder Point
(ROH - VB)
11

12. MTS Production - Discrete Industry Product Structure

This master data
is created in
BB 143
MTS Production - Discrete Industry
Product Structure
MTS
Production
– Discrete
Industry
Routing FERT
FIFO
10 Assembly
20 Final Acceptance
30 Painting (Ext. Processsing)
40 Packaging
50 GR w. Serial No Ass.
B
F126
EP
Master
Data
Enhance
ment in
BBs in
Layer 2
Finished Good, MTS-DI,
Batch-FIFO, Serial No
(FERT-PD)
RL* RW
SN
Rep.
Manufactr.
PP-Subcon.
(External
Processing)
All SD
processes
For Man. **
Rework
Processes
*Can be used but not
particulary explained
in process
FIFO
S21
Semifinished Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
R122
Semifinished Good
Phantom Ass.
(HALB-50-PD)
RAW Material
Batch-FIFO, Import
(ROH-PD)
IM Import
FB Fixed Bin
RAW Material
Consignment
(ROH - PD)
CP
R120
QM
RAW Material
QualityManaged
(ROH - PD)
S23
SC
S25
Semifinished Good Semifinished Good,
Subcontracting
Ext. Procurement
initial (HALB-20-PD)
(HALB-20-PD)
(HALB-30-PD)
S124
Semifinished Good
Subassembly
(HALB - PD)
R124
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
Raw Material,
Consumption,
FixedBin (ROH-VB)
R17
R14
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
R18
RW Rework
Master
Data
Enhance
ment in
BB 127
Layer 2
Master
Data
Enhance
ment in
BB 139
Layer 2
Master
Data
Enhance
ment in
BB 138
Layer 2
Procurement
& Consumpt.
of
Consigned
Inventory
Quality
Management
for
Procurement
with vendor
Evaluation
MM
Subcontracting
R20
RAW Material
(ROH - PD)
R27
RAW Material
Packaging Box
(ROH - PD)
FB
R13
QM Quality Mgmt
SC Subcontracting
IM
R128
R16
SN Serial Nos
Routing Subassembly
10 Mechan. Processing CNC
RAW Material
(ROH-PD)
EP External processing
B
B
S22
Batch Management
CP Consignment Processing
RL Revision Level
© 2013 SAP AG. All rights reserved.
* Except Scenarios: Third Party Order Proc. and Sales Bought In item
All other
Raw, SFGoods used
in MM /
Procurement
Processes
12

13. Repetitive Manufacturing Product Structure

Repetitive Manufacturing
This master data
is created in
BB 143
Product Structure
S21
Semifinished Good,
Repetitive Manuf.
(HALB-PD)
Master
Data
Enhance
ment in
BB 149
Layer 2
Repetitive
Manufacturing
Routing Rep.
Manufacturing
10 Assembly Repetitive
R12
RAW Material,
Rep. Manufacturing
(ROH - PD)
© 2013 SAP AG. All rights reserved.
Raw Material
used in MM /
Procurement
Processes
for Man.
13

14. MTO Production – without Variant Config. Product Structure

MTO Production – without Variant Config.
This master data
is created in
BB 143
Product Structure
Routing FERT
MTO
Production
– Discrete
Industry
FIFO
10 Assembly
20 Final Acceptance
30 Painting (Ext. Processsing)
40 Packaging
50 GR w. Serial No Ass.
B
F226
Master
Data
Enhance
ment in
BBs in
Layer 2
EP*
Finished Good, MTS-DI,
Batch-FIFO, Serial No
(FERT-PD)
SN
RL* RW*
Rep.
Manufactr.
SD
processes
in
Layer 1/2 **
*Can be used but not
particulary explained
in process
FIFO
S21
Semifinished Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
B
S22
R122
Semifinished Good
Phantom Ass.
(HALB-50-PD)
RAW Material
Batch-FIFO, Import
(ROH-PD)
IM
R128
RAW Material
Consignment
(ROH - PD)
CP
R120
QM
RAW Material
QualityManaged
(ROH - PD)
R16
RAW Material
(ROH-PD)
SN Serial Nos
IM Import
FB Fixed Bin
R124
RAW Material
(ROH-PD)
Raw Material,
Consumption,
FixedBin (ROH-VB)
R14
R18
Master
Data
Enhance
ment in
BB 139
Layer 2
Procurement
& Consumpt.
of
Consigned
Inventory
Quality
Management
for
Procurement
with vendor
Evaluation
S224
Semifinished Good
Subassembly
(HALB - PD)
R13
RAW Material
(ROH-PD)
Master
Data
Enhance
ment in
BB 127
Layer 2
S25
Semifinished Good Semifinished Good,
Subcontracting
Ext. Procurement
initial (HALB-20-PD)
(HALB-20-PD)
(HALB-30-PD)
R17
RW Rework
Batch Management
CP Consignment Processing
MM
Subcontracting
RL Revision Level
© 2013 SAP AG. All rights reserved.
R20
RAW Material
(ROH - PD)
R27
RAW Material
Packaging Box
(ROH - PD)
FB
Routing Subassembly
10 Mechan. Processing CNC
Master
Data
Enhance
ment in
BB 138
Layer 2
RAW Material
(ROH-PD)
EP External processing
B
SC
RAW Material
(ROH-PD)
QM Quality Mgmt
SC Subcontracting
S23
* Except Scenarios: Third Party Order Proc. and Sales Bought In item; Sell from Stock,
Returnables Processing
All other
Raw, SFGoods used
in MM /
Procurement
Processes
for Man.
14

15. MTS Production – Internal Product Dev. Product Structure

MTS Production – Internal Product Dev.
This master data
is created in
BB 143
Product Structure
Routing FERT
FIFO
10 Assembly
20 Final Acceptance
30 Painting (Ext. Processsing)
40 Packaging
50 GR w. Serial No Ass.
B*
F326
EP*
Rep.
Manufactr.
PLM Internal
Product
Dev.
BOM,
Routing
creation
in BB
210
Finished Good, PLM,
Batch-FIFO, Serial No
(FERT-PD)
SN*
RW* RL
*Can be used but not
particulary explained
in process
FIFO
S21
Semifinished Good,
Repetitive Manuf.
Initial (HALB-20 PD)
(HALB-PD)
R122
Semifinished Good
Phantom Ass.
(HALB-50-PD)
RAW Material
Batch-FIFO, Import
(ROH-PD)
IM Import
RAW Material
Consignment
(ROH - PD)
CP
R120
QM
RAW Material
Quality Managed
(ROH - PD)
S23
SC
S325A
Semifinished Good Semifinished Good,
Subcontracting
Ext. Procurement
initial (HALB-20-PD)
(HALB-20-PD)
(HALB-30-PD)
S124
Semifinished Good
Subassembly
(HALB - PD)
R13
R124
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
Raw Material,
Consumption,
FixedBin (ROH-VB)
R17
R14
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
FB Fixed Bin
QM Quality Mgmt
R18
RW Rework
SC Subcontracting
IM
R128
R16
SN Serial Nos
Master
Data
Enhance
ment in
BB 127
Layer 2
Master
Data
Enhance
ment in
BB 139
Layer 2
Procurement
& Consumpt.
of
Consigned
Inventory
Quality
Management
for
Procurement
with vendor
Evaluation
R20
RAW Material
(ROH - PD)
R27
RAW Material
Packaging Box
(ROH - PD)
FB
Routing Subassembly
10 Mechan. Processing CNC
S325B
Master
Data
Enhance
ment in
BB 138
Layer 2
Semifinished Good,
Ext. Procurement
Replacement
(HALB-20-PD)
in ECM subprocess
RAW Material
(ROH-PD)
EP External processing
B
B
S22
Batch Management
CP Consignment Processing
MM
Subcontracting
All other
Raw, SFGoods used
in MM /
Procurement
Processes
RL Revision Level
© 2013 SAP AG. All rights reserved.
15

16. SAP Best Practices Work center Hierarchy

SAP Best Practices
This master data
is created in
BB 143
Work center Hierarchy
TOT_PLNT
Plant - Top Level
0001
PVRSN_MF
DISCR_MF
Process / REM Manufacturing
- Top Level
0001 (Cap 001/002)
Discrete Manufacturing
- Top Level
0001 (Cap 001/002)
PACK01
MIXING
Mixing Liquid
Packing Line
0001 (Cap 001)
0008 (Cap 001/002)
PACK02
Bottling
Hand Packing Work Center
Bottling Liquid
0001 (Cap: 002)
0008 (Cap: 001/002)
ASSEMBLY
Packing
Capacity Machine
Packing Liquid
0001 (Cap 001)
0008 (Cap: 001/002)
TESTING
Winding
Capacity Machine
Winding REM
0001 (Cap 001)
0007 (Cap 001)
TECHNIC
CNC processing
0001 (Cap 001)
WORK
Work Machine / Person
0001 (Cap: 001/002)
© 2013 SAP AG. All rights reserved.
16

17.

© 2013 SAP AG. All rights reserved.
No part of this publication may be reproduced or transmitted in any form or for any purpose without the express permission of SAP AG.
The information contained herein may be changed without prior notice.
Some software products marketed by SAP AG and its distributors contain proprietary software components of other software vendors.
National product specifications may vary.
These materials are provided by SAP AG and its affiliated companies ("SAP Group") for informational purposes only, without representation or
warranty of any kind, and SAP Group shall not be liable for errors or omissions with respect to the materials. The only warranties for SAP Group
products and services are those that are set forth in the express warranty statements accompanying such products and services, if any. Nothing
herein should be construed as constituting an additional warranty.
SAP and other SAP products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of SAP AG in
Germany and other countries.
Please see http://www.sap.com/corporate-en/legal/copyright/index.epx#trademark for additional trademark information and notices.
© 2013 SAP AG. All rights reserved.
17